Application Instructions
Step-by-step guides for proper application of all Amawi Technologies thermal products
Clean the Surfaces
Remove all old thermal compound using Fusion Cleaner or 90%+ isopropyl alcohol with lint-free wipes. Clean both the CPU/GPU die and the heatsink base. Allow surfaces to dry fully. Even a thin alcohol film causes poor adhesion and reduced performance.
Choose Your Application Method
Standard desktop CPUs (Intel/AMD square IHS): a pea-sized dot (3–4 mm) in the center spreads perfectly under heatsink pressure. Large or elongated dies (AMD Threadripper, EPYC, Intel Xeon W): use a thin horizontal line or X-pattern. GPUs: a thin horizontal line across the die. Laptop bare dies (no IHS): a dot no larger than 2 mm (die size is small, less is more). Never pre-spread paste manually; let mounting pressure do the work.
Apply the Paste
Dispense directly from the syringe. The layer should be 0.1–0.2 mm thick after mounting, far thinner than most people expect. If you can clearly see a thick blob, you have applied too much. A 2g syringe yields approximately 4 applications on a standard desktop CPU using the correct minimal dot, fewer if you apply too much and slightly more on smaller laptop dies.
Mount the Heatsink
Lower the heatsink straight down without sliding it sideways; sliding traps air bubbles and spreads paste unevenly. Secure mounting screws in a diagonal/cross pattern, tightening each a little at a time to ensure even pressure across the die. Uneven pressure is the most common cause of hot spots.
Break-In & Verification
Run a stress test (Prime95, Cinebench, or a gaming session) for 15–30 minutes. Thermal paste performs slightly better after the first heat cycle as it settles into surface micro-imperfections. Record your idle and load temperatures as your baseline for future comparisons. True steady-state performance shows after 24 hours of normal use.
Measure the Thermal Gap
The gap is the distance between the component surface and the heatsink plate when fully mounted. Check your device's service manual or teardown guides for known values. For GPUs: VRAM gaps are typically 1.0–1.5 mm; VRM gaps 1.0–2.0 mm. For M.2 SSDs: 1.0–2.0 mm depending on the chassis pad. For laptops: 0.5–1.5 mm. If measuring manually, use a feeler gauge or stack known-thickness card between the component and heatsink contact surface.
Choose the Right Thickness
Select a pad that equals or slightly exceeds the measured gap; pads compress 10–30% under mounting pressure. When in doubt, go 0.5 mm thicker than your measurement. A pad that is too thin will not make contact; one that is slightly too thick compresses correctly. Never stack two pads to add thickness; use a single pad of the correct thickness.
Cut to Size
Use scissors or a sharp hobby knife. Cut each pad piece to match the individual component footprint; do not use one large piece spanning multiple chips. Covering adjacent SMD capacitors or resistors with pad material can cause shorts or prevent proper heatsink seating. For VRAM chips, cut individual squares for each chip.
Remove Both Protective Films
Peel off both protective films completely. Handle the pad by its edges; finger oils on the contact surface reduce conductivity. The pad should feel slightly tacky on both sides when the films are removed.
Place, Seat, and Mount
Position the pad on the component and press gently; it self-adheres on contact. Lower the heatsink or chassis cover and secure normally. No additional adhesive is needed. Pads can typically be reused 2–3 times if removed carefully and kept clean. Replace if the pad has torn, dried out, or has lost its tackiness.
Liquid metal is electrically conductive and reacts with aluminum. Read all steps before applying.
Critical Safety Check: Read Before Applying
Liquid metal is electrically conductive and will permanently damage any electronics it contacts. It also reacts with aluminum, corroding the heatsink. Suitable surfaces: copper heatsink base, nickel-plated copper base, bare CPU die (no IHS). Do NOT use on: GPU dies (SMD components too close to the die edge), consoles (PS5, Xbox have aluminum vapor chambers; liquid metal destroys them), laptops without confirmed copper heatsink contacts, or any heatsink with an aluminum base.
Mask and Protect the Area
Apply Fusion Protector tape (or quality electrical tape) around all four edges of the CPU die, covering the PCB around the die but leaving the die surface exposed. Also cover any SMD components, capacitors, or traces visible near the socket area. This masking is mandatory. Liquid metal can migrate under pressure and a single drop on a capacitor can destroy the board.
Prepare Both Surfaces
Clean the CPU die and heatsink base with 90%+ IPA using lint-free wipes. Allow 2–3 minutes to dry completely. Both surfaces must be free of old paste, oil, oxidation, and residue. Contamination causes liquid metal to bead and not spread; if this happens, clean again more thoroughly.
Apply a Micro-Thin Layer to Both Surfaces
Dispense a drop the size of a small rice grain (≈0.03–0.05 ml) onto the die. Spread in circular motions with the included cotton swab or brush until you achieve a mirror-like silver finish covering the entire die surface with no dry spots. Apply the same micro-thin layer to the heatsink base contact area. The total amount on both surfaces combined should be under 0.1 ml. Less is critical: excess liquid metal is the main source of short-circuit incidents.
Inspect, Then Mount
Before mounting, inspect carefully for any liquid metal outside the masked area. Clean any migration with IPA immediately. Mount the heatsink straight down without sliding. After first boot, verify temperatures are lower than before (typical improvement: 10–25°C on laptops, 3–8°C on desktop IHS). If the system fails to POST, shut down immediately and inspect for shorts.
When to Use Thermal Putty
Putty is the right choice when: surface heights vary across a component (LED arrays, mixed-height power inductors), the gap is irregular, or cutting flat pads to precise shapes is impractical. It conforms to any geometry without tools. It is not the optimal choice for high-pressure mounts like desktop CPU coolers where paste performs better, or where very tight thermal resistance is required.
Surface Cleaning
Clean both contact surfaces with isopropyl alcohol and allow to dry. Unlike paste, putty tolerates slightly less pristine surfaces, but removing loose debris and old compound is still important for good thermal contact.
Condition the Putty
Work the putty between your fingers for 15–20 seconds until it softens and becomes uniformly pliable. Shape it into a flat sheet approximately the same footprint as the component, with thickness matching your measured gap. It should feel smooth and consistent throughout; cold spots that remain stiff indicate insufficient conditioning.
Apply and Mount
Press the putty sheet onto the component surface. Lower the heatsink; putty will deform and fill all gaps and surface voids. Apply normal mounting pressure. Excess putty will push out to the sides; trim cleanly with a wooden toothpick or plastic spudger. Putty is reusable: remove, reshape, and reapply when remounting.
Surface Preparation
Clean the CPU/GPU IHS and heatsink base thoroughly with 90%+ IPA. Phase change material forms a tighter bond to clean metal than standard thermal paste; preparation quality directly affects final performance.
Cut and Apply the Pad
Cut the pad to match the IHS or die dimensions. Remove the protective film from one side and place it centered on the CPU, adhesive-side down. Press gently to secure. Then remove the film from the top face.
Initial Mount
Mount the heatsink normally and secure all mounting points. At room temperature the pad is solid; this is expected. It will not reach operating state until it heats up.
Break-In Cycle
Run a CPU/GPU stress test (Prime95, FurMark, Cinebench loop) for 20–30 minutes. At approximately 50–60°C the material transitions to a liquid phase, flows into all micro-gaps between the surfaces, then re-solidifies as it cools. The first 2–3 thermal cycles produce progressively improving results as the material fully settles.
Do Not Remove After Break-In
After break-in, the pad has conformed precisely to your specific surface pair. Removing the heatsink breaks this bond; the pad cannot re-conform to a different or repositioned surface the same way. If you must remount, replace the pad with a fresh piece. Store unused pads in a sealed bag at room temperature.
When to Clean
Replace thermal compound when: temperatures have risen 5°C+ above your original baseline, you are installing a new cooler, the compound has dried or cracked visibly, or as part of annual laptop maintenance. Laptops need cleaning more frequently than desktops; restricted airflow and higher operating temperatures cause paste to dry out faster, typically within 2–4 years.
Removing Thermal Paste
Apply a small amount of Fusion Cleaner to the surface. Let it soak for 15–20 seconds to dissolve and loosen the compound. Wipe away with a lint-free cloth using straight strokes; avoid circular motions, which redeposit residue. Repeat until no compound is visible. Finish with a clean dry wipe to remove solvent residue.
Removing Thermal Pads
Pads can usually be lifted from one corner with a fingernail or plastic spudger. If stuck, apply Fusion Cleaner along the edge and wait 30 seconds before lifting. Avoid metal tools; they can scratch PCB pads or damage the fragile component leads underneath.
Removing Liquid Metal
Apply IPA generously to the surface and use cotton swabs to absorb. Liquid metal does not dissolve; the IPA helps gather it into a rollable bead that can be lifted off. Use multiple fresh swabs and repeat until no silver residue remains. Dispose of used swabs carefully; do not let liquid metal droplets fall onto the PCB. This process takes patience; do not rush.
Final Inspection
After removing compound, do a final clean pass with fresh Fusion Cleaner on a new wipe. The surface should appear uniformly matte and streak-free. Hold it at an angle under a light; any remaining residue will show as a sheen. A perfectly clean surface is essential: new compound on old residue cannot achieve its rated thermal conductivity.
General Tips & Best Practices
Use 90%+ Isopropyl Alcohol
Lower concentrations leave a water residue. 99% IPA is ideal. Fusion Cleaner is formulated specifically for thermal compound removal.
Tighten in a Cross Pattern
Tighten each screw a quarter-turn at a time, alternating diagonally. This ensures even pressure and prevents CPU/GPU die flex that creates hot spots.
Record Your Baseline
Note idle and load temperatures after a fresh application. Future comparisons tell you exactly when it is time to reapply.
Do Not Slide the Heatsink
Lower straight down. Sliding distributes paste unevenly, traps air, and can scrape compound off the die before pressure is applied.
Never Mix Compounds
Different formulations can react chemically or produce unpredictable consistency. Always clean completely before switching to a different product.
Seal Syringes After Use
Cap the syringe tip and store at room temperature away from heat and direct sunlight. Properly stored paste lasts 3–5 years.
Still have questions?
Our support team is happy to help with product selection, application advice, or troubleshooting.
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