FUSION CLEANER KIT

The kit contains: 20x large-format alcohol wipes (12x15cm, 99.9% isopropyl purity), 3x precision spatulas, 3x cotton swabs, and 3x disposable gloves - all in a resealable package. The large wipe count makes this ideal for shop use, bulk repastes, or anyone who prefers to have supplies on hand without reordering frequently.

The wipes are designed for CPU dies (silicon, nickel-plated, copper IHS), GPU dies and heatsink contact plates, thermal pad residue removal from PCB contact points, and general electronic component cleaning. They're safe on most metal heatsink materials - copper, nickel, aluminum, and stainless steel.

Yes. 99.9% isopropyl alcohol is the standard cleaner for electronic components. It evaporates quickly and leaves no residue. It's safe on PCB substrates, solder joints, capacitors, and most plastics. Avoid prolonged contact with certain adhesive labels or silkscreen printing. Wait for complete evaporation before powering on - this typically takes under 30 seconds.

For paste removal: first wipe with a wet alcohol wipe to dissolve the old compound. Let it sit for 5–10 seconds to loosen, then wipe again in a single direction. Use a cotton swab for corners and edges. For final prep before new paste application: a clean wipe over the die surface removes any remaining residue. The spatulas are for spreading paste or putty manually on large contact areas.

With 20 wipes, you have enough for 10–20 complete CPU/GPU repaste cleaning cycles (typically 1–2 wipes per component - one for old paste removal, one for final surface prep). The 3 spatulas cover multiple sessions, and the gloves protect your hands during messy pastes or liquid metal work. The resealable packaging keeps unused wipes from drying out.