HALNZIYE HY2610

Use putty whenever the gap is uneven or unknown. Thermal pads need the right thickness per component; HY2610 molds itself around mixed-height VRAM, VRM and controller chips in one pass. If your components all share one known gap height, a pad is fine. For everything else, putty is the safer choice.

Yes, it is top tier. Typical gap filler putties and pads sit between 1 and 6 W/mK. At 10 W/mK the HY2610 outperforms most pre-cut pads while also removing the thickness-matching problem entirely.

Yes. HY2610 stays moldable, so you can lift it, re-form it and reapply it several times without losing performance. It never cures, does not dry out and does not pump out from between components.

Yes, GPU VRAM and VRM arrays are its main use case, and it is a proven choice for PS5 and Xbox Series X memory chips. It is electrically non-conductive, so direct contact with chips and surrounding components is safe.

A full high-end graphics card (all VRAM plus VRM rows) typically uses 8 to 12g, so the 20g pack covers one complete GPU repad with reserve, or several smaller jobs like M.2 SSDs and console memory.

Amawi Technologies is an official authorized Halnziye reseller for the EU. Stock comes directly from the manufacturer supply chain and ships from Germany with full EU consumer rights.